发明名称 |
ELECTRICAL CONNECTION MATERIAL AND ELECTRICAL CONNECTION METHOD |
摘要 |
The present invention is to provide an electrical connection material through which an electrical connection via conductive particles can be performed reliably regardless of a little unevenness of an object. The electrical connection material is'an electrical connection material 100 for electrically connecting an electrical connection portion of a first object 4 and an electrical connection portion of a second object 2. The electrical connection material 100 comprises a first film-like adhesive layer 6 which is a film-like adhesive layer arranged on the first object 4 and is composed of a plurality of conductive particles 7, a first binder 8 containing the conductive particles 7, and a first filler F1 and a second film-like adhesive layer 9 which is arranged on the first film-like adhesive layer 6 and is composed of a second binder 9A whose viscosity is lower than that of the first binder 8 and a second filler F2. <IMAGE> |
申请公布号 |
EP1189308(B1) |
申请公布日期 |
2007.03.07 |
申请号 |
EP20010915737 |
申请日期 |
2001.03.23 |
申请人 |
SONY CORPORATION |
发明人 |
HONDA, NORIYUKI;HANAI, NOBUHIRO;NAKADA, MASAKAZU |
分类号 |
H01R11/01;H01B5/16;H01L21/56;H01L21/60;H01R4/04;H01R43/00;H05K3/32 |
主分类号 |
H01R11/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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