发明名称 |
SENSOR CHIP AND MANUFACTURING METHOD THEREOF |
摘要 |
<p>Provided are a sensor chip and a manufacturing method of this sensor chip, that includes a substrate, a cover layer, a spacer layer sandwiched between the substrate and the cover layer, and a hollow reaction section between the substrate and the cover layer, wherein warping due to changes in the environmental temperature and humidity does not occur. A sensor chip is provided including: a substrate; a cover layer; a spacer layer sandwiched between the substrate and the cover layer; a hollow reaction section provided between the substrate and the cover layer; and a detection section provided in the hollow reaction section, wherein the substrate and the cover layer are made of the same material and have the same thickness, and a material and a shape of the spacer layer are symmetrical with respect to a plane which is parallel to the substrate and located at equal distances from the substrate and from the cover layer, and a manufacturing method of the sensor chip is provided.</p> |
申请公布号 |
EP1760460(A1) |
申请公布日期 |
2007.03.07 |
申请号 |
EP20050753492 |
申请日期 |
2005.06.21 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD.;NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCEAND TECHNOLOGY |
发明人 |
HOSOYA, T.;KAIMORI, S.;ICHINO, M.;KARUBE, I.;GOTOH, M.;NAKAMURA, H.;KURUSU, F.;SHIKAWA, T. |
分类号 |
G01N27/327;G01N27/416 |
主分类号 |
G01N27/327 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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