| 摘要 |
A method for manufacturing a micromechanical structure is provided. A silicon substrate is provided, and the silicon substrate is etched to define a section upon which the micromechanical structure can be formed. A surface layer is formed on the surface of the substrate. Etching is then performed to form a micromechanical structure from the surface layer, and further etching releases the micromechanical structure from the substrate. A device comprising a micromechanical structure manufactured according to the method is also provided. |
