发明名称 Heat sink vacuum packaging procedure
摘要 A heat sink vacuum packaging procedure to rapidly complete the packaging of a heat sink without drilling, pipe welding, vacuum pumping, or other processes. Because the packaging procedure saves much time and labor, the manufacturing cost of the heat sink is relatively reduced. During packaging, no welding process is employed, therefore the invention prevents accidentally flowing of tin solder into the inside of the heat sink to affect the quality of the heat sink, and the quality of the heat sink is maintained.
申请公布号 US7185434(B2) 申请公布日期 2007.03.06
申请号 US20040793783 申请日期 2004.03.08
申请人 TATUNG CO., LTD. 发明人 CHIU LIU-HO;WU CHANG-HUI;CHOU MING-DER;CHANG CHEN-MING
分类号 B21D53/02;F28D15/02;B21D39/02;B21D51/32;B21D53/04 主分类号 B21D53/02
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