MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD

摘要

A method for manufacturing a printed circuit board is provided to prevent a short circuit caused by cutting in a cutting process without exposing the circuit to a border of the printed circuit board. A method for manufacturing a printed circuit board includes the steps of: closely adhering a photosensitivity dry film on a surface of the printed circuit board(S210); closely adhering and irradiating a master film on the dry film(S220); removing the dry film by dissolving a non-irradiated region with solution liquid(S230); removing a copper film-exposed region by oxidizing the copper film-exposed region(S240); forming a circuit by removing the dry film of the irradiated region(S250); cutting a border of the printed circuit board after forming the circuit; and removing a region corresponding to a cut region in a cutting process.