发明名称 Semiconductor device with decoupling capacitor and method of fabricating the same
摘要 The semiconductor device includes a semiconductor layer formed on a semiconductor substrate (e.g., SOI or HOT), and an opening exposing the semiconductor substrate through semiconductor layer. A decoupling capacitor is formed in the opening and includes an epitaxial layer formed in the opening on the semiconductor substrate, and a gate structure disposed on the epitaxial layer.
申请公布号 KR100688546(B1) 申请公布日期 2007.03.02
申请号 KR20050040272 申请日期 2005.05.13
申请人 发明人
分类号 H01L27/04 主分类号 H01L27/04
代理机构 代理人
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