WIRE BONDING APPARATUS HAVING CONTROL UNIT AND SENSOR FOR TEMPERATURE OF HEATER BLOCK

摘要

A heater block temperature sensor and a wire bonding apparatus having a controller are provided to precisely control temperature of heater block by using a temperature sensor on the heater block and a temperature offset of the heater block. A package substrate(20) is mounted on a heater block(60). A semiconductor chip(10) is adhered to the package substrate. The heater block transfers heat to the semiconductor chip and the package substrate. The heater block is fixed on a heater block body(50). A heater cartridge(51) is installed on the heater block body to generate heat. A temperature controller(80) compensates a temperature of the heater block. A window clamp(70) opens a bonding region of the package substrate and fixes the package substrate mounted on the heater block. A capillary(40) wire-bonds the semiconductor chip and the package substrate with a conductive metal wire. A temperature sensor(91) is mounted on a surface of the heater block to measure the temperature of the heater block. A controller(90) is connected to the temperature sensor and the temperature controller and has a temperature setting algorithm.