发明名称 |
Double interface electronic communication module for chip card, has substrate with electric contacts, antenna with spires arranged outside area covered by contacts, and protrusions located on side of contacts and in area overhanging spires |
摘要 |
The module has a substrate (27) with an electric contact terminal block which permits to operationally contact the contacts of a reader. An antenna has spires (13) and terminals connected to the terminals of a microelectronic chip positioned on a face of the module. The spires are arranged outside the area covered by electric contacts (17) of the terminal block. Metallic protrusions (33) are positioned on the side of the contacts and in an area overhanging the spires. |
申请公布号 |
FR2890212(A1) |
申请公布日期 |
2007.03.02 |
申请号 |
FR20050008860 |
申请日期 |
2005.08.30 |
申请人 |
SMART PACKAGING SOLUTIONS (SPS) SOCIETE PAR ACTIONS SIMPLIFIEE |
发明人 |
ARTIGUE OLIVIER;BOCCIA HENRI;BRUNET OLIVIER;PATRICE PHILIPPE;PEYTAVIN IVAN;SEMORI STEPHANE |
分类号 |
G06K19/077 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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