| 摘要 |
A memory device is provided to prevent noise from being applied to a pad where a low current is applied, by adjacently bonding a number of pads of a low current and adjacently bonding a number of pads of high current. In a memory device comprising a number of power supply pads and a number of first and second internal circuits, a first pad group comprises the power supply pads connected to the respective first internal circuits. A second pad group comprises the power supply pads connected to the respective second internal circuits. The first internal circuit uses a lower current than the second internal circuit. In the first and second pad groups, more than two power supply pads are multi-bonded.
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