| 摘要 |
A nozzle element of a head using a semiconductor process and a method of manufacturing the same are provided to improve wear resistance by forming an adhesion layer, a protection layer, and a coating layer. A nozzle element of a head using a semiconductor process includes has a plate member. The plate member includes a first outer side plate member, a center plate member, and a second outer side plate member. A chamber forming layer(2), a depth adjustment layer(4), and a nozzle forming layer(6) are sequentially formed on the plate member. A plurality of nozzle holes(14) are formed at the nozzle forming layer with a masking etching process to inject ink. A plurality of chambers are formed at the chamber forming layer to supply the ink to the nozzle holes to manufacture a nozzle member. The nozzle member is adhered to an end portion of the plate member to supply and inject the ink.
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