| 摘要 |
The present invention provides a bump ball device and a placing method thereof. The bump ball device having a die on which I/O terminal of a plurality of circuit elements are arranged, includes: a plurality of bonding pads which are electrically connected to the I/O terminals of the circuit elements; and a plurality of test pads which are arranged corresponding to the bonding pads and electrically connected to the bonding pads. Even the test system of the low performance can perform the precise electrical characteristic test, thereby reducing test cost for the electrical characteristic test and manufacturing cost of the bump ball device. Further, since the electrical characteristic test is performed through the additional test pads before forming the bump balls, the manufacturing cost is reduced. |
