SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

摘要

A substrate processing apparatus is provided to sufficiently planarize the upper surface of a deposition layer by intermittently pressing the upper surface of the deposition layer by a pressure member. A retaining support member(121) retains and supports a substrate(W) in a process receptacle(120). A heating member(122) heats the substrate supported by the retaining support member. A pressure member whose lower surface is flat presses the upper surface of a substrate deposition layer downward. A control part(150) controls the operation of the heating member and the pressure member in a manner that the upper surface of the substrate deposition layer heated by the heating member is intermittently pressed by the pressure member. An exhaust part(143) exhausts the atmosphere of the process receptacle. A decompression apparatus decompress the process receptacle.