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发明名称
晶圆承载治具及应用其之溅镀机
摘要
一种晶圆承载治具及应用其之溅镀机。晶圆承载治具系用以使用于一溅镀机中。溅镀机系用以对一第一晶圆进行溅镀,其中第一晶圆具有一第一直径,晶圆承载治具之直径系实质上等于第一直径。晶圆承载治具系具有一承载凹槽,用以承载一第二晶圆。第二晶圆系具有一第二直径,该第二直径系小于该第一直径。
申请公布号
TW200709325
申请公布日期
2007.03.01
申请号
TW094127923
申请日期
2005.08.16
申请人
日月光半导体制造股份有限公司
发明人
黄泰源;杜嘉秦;许志祥;刘水源;杨志斌;吴文中
分类号
H01L21/68(2006.01);H01L21/00(2006.01)
主分类号
H01L21/68(2006.01)
代理机构
代理人
林素华
主权项
地址
高雄市楠梓加工区经三路26号
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