| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoplastic resin film which has a small thermal shrinkage rate in a film-forming direction and small dimensional change and is suitable as a material for electronics or the like, and to provide a method for producing the same. SOLUTION: This thermoplastic resin film comprising (A) a thermoplastic polyimide resin and (B) a polyarylketone in a total amount of 100 pts.mass and (C) a filler in an amount of 5 to 50 pts.mass, and having a thermal shrinkage rate of 0.01 to 6.5% in a film-forming direction, and the method for producing the film is characterized by cooling the film, then controlling a value (t/T) obtained by dividing the thickness (t) of the film by the opening degree (T) of the die tip of an extruder to a range of 0.1 to 0.5, and cooling the film in specific cooling conditions, in an extrusion cast method for contact-cooling the film melt-extruded from an extruder with a coolant. COPYRIGHT: (C)2007,JPO&INPIT
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