发明名称 DEVICE MOUNTING STRUCTURE, DEVICE MOUNTING METHOD, ELECTRONIC DEVICE, DROPLET EJECTING HEAD, AND DROPLET EJECTOR
摘要 PROBLEM TO BE SOLVED: To provide a device mounting structure which is favorably applicable to narrowing of a pitch of wiring or to wiring connection via steps. SOLUTION: The device mounting structure is equipped with an intermediate connector 500 arranged between a unit 360 where devices 200A and 200B are mounted, and bodies 10 and 20; a wiring line 510 which is set at a peripheral face of the intermediate connector 500 to be electrically connected to each of the unit 360 and bodies 10 and 20; and a groove 700 which is formed in the bodies 10 and 20 and in which at least a part of the intermediate connector 500 is incorporated. An electrical connection position between the intermediate connector 500 and the body 10, 20 is a bottom part of the groove 700 in the body 10, 20 of the device mounting structure. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007050639(A) 申请公布日期 2007.03.01
申请号 JP20050238338 申请日期 2005.08.19
申请人 SEIKO EPSON CORP 发明人 YODA TAKESHI
分类号 B41J2/045;B41J2/055;B41J2/16 主分类号 B41J2/045
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