发明名称 |
DEVICE MOUNTING STRUCTURE, DEVICE MOUNTING METHOD, ELECTRONIC DEVICE, DROPLET EJECTING HEAD, AND DROPLET EJECTOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a device mounting structure which is favorably applicable to narrowing of a pitch of wiring or to wiring connection via steps. SOLUTION: The device mounting structure is equipped with an intermediate connector 500 arranged between a unit 360 where devices 200A and 200B are mounted, and bodies 10 and 20; a wiring line 510 which is set at a peripheral face of the intermediate connector 500 to be electrically connected to each of the unit 360 and bodies 10 and 20; and a groove 700 which is formed in the bodies 10 and 20 and in which at least a part of the intermediate connector 500 is incorporated. An electrical connection position between the intermediate connector 500 and the body 10, 20 is a bottom part of the groove 700 in the body 10, 20 of the device mounting structure. COPYRIGHT: (C)2007,JPO&INPIT
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申请公布号 |
JP2007050639(A) |
申请公布日期 |
2007.03.01 |
申请号 |
JP20050238338 |
申请日期 |
2005.08.19 |
申请人 |
SEIKO EPSON CORP |
发明人 |
YODA TAKESHI |
分类号 |
B41J2/045;B41J2/055;B41J2/16 |
主分类号 |
B41J2/045 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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