发明名称 |
Wiring board construction including embedded ceramic capacitors(s) |
摘要 |
A wiring board includes a substrate core, ceramic capacitors and a built-up layer. The substrate core has a housing opening portion therein which opens at a core main surface. The ceramic capacitors are accommodated in the housing opening portion and oriented such that the core main surface and a capacitor main surface of each capacitor face the same way. The built-up layer includes semiconductor integrated circuit element mounting areas at various locations on a surface thereof. In the substrate core, each ceramic capacitor is respectively disposed in an area corresponding to each semiconductor integrated circuit element mounting area.
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申请公布号 |
US2007045815(A1) |
申请公布日期 |
2007.03.01 |
申请号 |
US20060513249 |
申请日期 |
2006.08.31 |
申请人 |
URASHIMA KAZUHIRO;YURI SHINJI;SATO MANABU;OTSUKA JUN |
发明人 |
URASHIMA KAZUHIRO;YURI SHINJI;SATO MANABU;OTSUKA JUN |
分类号 |
H01L23/04 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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