| 发明名称 |
MICROELECTROMECHANICAL DEVICE PACKAGING WITH AN ANCHORED CAP AND ITS MANUFACTURE |
| 摘要 |
<p>Integrated circuit (1) comprising a substrate (2), an active component (13) above the substrate (2), a cavity (14) surrounding partially the active component (13) , a low dielectric region (15) surrounding partially the cavity (14) and a protective barrier (16) arranged around the low dielectric region (15).</p> |
| 申请公布号 |
WO2007022978(A1) |
申请公布日期 |
2007.03.01 |
| 申请号 |
WO2006EP08307 |
申请日期 |
2006.08.24 |
| 申请人 |
STMICROELECTRONICS (CROLLES 2) SAS;KONINKLIJKE PHILIPS ELECTRONICS N.V.;CHARBUILLET, CLEMENT;GOSSET, LAURENT |
发明人 |
CHARBUILLET, CLEMENT;GOSSET, LAURENT |
| 分类号 |
B81B7/00 |
主分类号 |
B81B7/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
