| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet which prevents or eliminates air entrapments or blisters and has through-holes formed by heat processing without spoiling the appearance of the pressure-sensitive adhesive sheet. SOLUTION: The pressure-sensitive adhesive sheet 1 is composed of a substrate 11 and a pressure-sensitive adhesive layer 12 and has a plurality of through-holes 2 passing through from one side to the other formed by heat processing. The substrate 11 has a temperature of thermal decomposition peak of≤450°C at which the rate of weight loss of the substrate 11 becomes largest, when it is heated in a nitrogen environment at an ascending rate of temperature of 20°C/min. The difference in temperature between the peak of heat decomposition and the peak of melting is≤250°C. COPYRIGHT: (C)2007,JPO&INPIT |
