发明名称 Photosensitive resin composition and method for manufacturing semiconductor device using the same
摘要 A photosensitive resin composition comprising: a quinone diazide sulfonic acid ester of a phenol compound represented by formula (I) as defined in the specification; and a polybenzoxazole precursor, and a method for manufacturing a semiconductor device using the same.
申请公布号 US2007048656(A1) 申请公布日期 2007.03.01
申请号 US20060511375 申请日期 2006.08.29
申请人 FUJI PHOTO FILM CO., LTD. 发明人 SATO KENICHIRO;YAMANAKA TSUKASA
分类号 G03C5/18 主分类号 G03C5/18
代理机构 代理人
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