| 摘要 |
The invention relates to a method and a device for permanently connecting integrated circuits (1) to at least one substrate (2) located therebelow by means of an adhesive (3) which is disposed therebetween and on the edges relative to the integrated circuits (1). In order to cure the adhesive (3), light (19) having a wavelength ranging between 280 and 900 nm is radiated onto the top or/and bottom face of the assembly comprising the substrate (2) and one of the integrated circuits (1) so as to polymerize the adhesive (3). |
