Micromechanical element has capping wafer having entrance that is formed corresponding to section of function wafer where at least one electrical contact area is formed

摘要

A capping wafer is comprised of a silicon substrate (1) and a thin glass substrate (2). At least one electrical contact area (6) is arranged on another silicon substrate (5) comprising a function wafer to which the capping wafer is connected by anodic bonding. An entrance (9) is formed in the capping wafer corresponding to the section of the function wafer where the electrical contact area is formed.