| 摘要 |
<p>Various methods (600,700) and systems (100) measure, determine, or align a position of a laser beam spot relative to a semiconductor substrate (130) having structures (410) on or within the semiconductor substrate (130) to be selectively processed by delivering a processing laser beam to a processing laser beam spot (135). The various methods (600,700) and systems (100) utilize those structures (410) themselves to perform the measurement, determination, or alignment.</p> |
