| 摘要 |
PROBLEM TO BE SOLVED: To provide a device mounting structure which is favorably applicable to narrowing of a pitch of wiring or to wiring connection via steps. SOLUTION: The device mounting structure is equipped with a projection 42 formed on one face of a unit 360 where devices 200A and 200B are mounted, a first wiring line 363 which connects a top part of the projection 42 in the unit 360 with mounting positions of the devices 200A and 200B, a groove 700 which is formed in bodies 10 and 20 and in which at least a part of the projection 42 is fitted, and a second wiring line 80 which is set at a bottom part of the groove 700 in the bodies 10 and 20 to be electrically connected with the first wiring line 362. The first wiring line 362 includes both a resin layer 370 which includes metal particles, and a metal film 371 on the resin layer 370. COPYRIGHT: (C)2007,JPO&INPIT
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