SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

摘要

A first semiconductor chip (21) is arranged on a chip mounting member (11), and a bonding wire (36) connected to an electrode pad (21E) of the first semiconductor chip (21) is covered with a first insulating adhesive (31) and fixed. A second semiconductor chip (22) is stacked in layer on the first semiconductor chip (21) through the first insulating adhesive (31). Thus, problems such as disconnection and short-circuiting of the bonding wire directly above the substrate are eliminated for mounting the chip in layer.