发明名称 Device for tempering a wafer or other substrate has two tempering units for tempering main body in different temperature ranges and using two different tempering fluids such as alcohol and air
摘要 <p>The device has a main body (110) tempered through two tempering units (200, 300) of which the first tempers the body in a first temperature range between two temperatures of which the first temperature is lower than the second and uses a first tempering fluid such as alcohol, whilst the second tempering unit (300) tempers the main body in a second temperature range between a third and fourth temperature where the third temperature is lower than the fourth and the second tempering unit is tempered by a second different fluid (320) such as air or nitrogen. The second temperature is lower than the fourth temperature. An electric tempering device (400) can be used which has a Peltier element formed as a flat dividing layer between the first and second tempering units.</p>
申请公布号 DE202005016216(U1) 申请公布日期 2007.03.01
申请号 DE20052016216U 申请日期 2005.10.17
申请人 ATT SYSTEMS GMBH 发明人
分类号 H01L21/68 主分类号 H01L21/68
代理机构 代理人
主权项
地址