发明名称 METHOD AND DEVICE FOR SOLDERING
摘要 PROBLEM TO BE SOLVED: To prevent the occurrence of wrinkles on a solder surface. SOLUTION: In a heating chamber 2 whose temperature is lower than the solder melting temperature with a pressure lower than the atmospheric pressure, an object 6 comprising a solder and a part to be soldered is irradiated with hydrogen radical. With the heating chamber 2 provided with a reducing atmosphere or inactive atmosphere at the atmospheric pressure or near it, the object is heated to the temperature of solder melting point or higher by a heating plate 4. The object 6 is cooled by a cooling device 30 in a cooling chamber 24 with the reducing atmosphere or inactive atmosphere at the atmospheric pressure or near it. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007053245(A) 申请公布日期 2007.03.01
申请号 JP20050237463 申请日期 2005.08.18
申请人 SHINKO SEIKI CO LTD 发明人 HAGIWARA TAIZO
分类号 H05K3/34 主分类号 H05K3/34
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