发明名称 |
Thermal interface material and method for making the same |
摘要 |
A thermal interface material and a making method thereof are disclosed. The thermal interface material includes a thermal conductive substrate having a first surface and an opposing second surface; and at least one organic metal multilayer film formed on at least one of the first and second surfaces. The organic metal multilayer film comprises a plurality of metal layers and a plurality of organic layers. Each of the metal layers and each of the organic layers are alternately linked to one by another. Each of the metal layers comprises a plurality of metal particles each in contact with one or more organic molecules of adjacent organic layers.
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申请公布号 |
US2007048520(A1) |
申请公布日期 |
2007.03.01 |
申请号 |
US20060440292 |
申请日期 |
2006.05.24 |
申请人 |
HON HAI PRECISION INDUSTRY CO., LTD. |
发明人 |
HSIAO BOR-YUAN;CHANG CHUN-YI;TUNG TSAI-SHIH |
分类号 |
B32B5/16;B05D1/12;B05D1/18;B05D1/36;B32B15/04 |
主分类号 |
B32B5/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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