发明名称 Thermal interface material and method for making the same
摘要 A thermal interface material and a making method thereof are disclosed. The thermal interface material includes a thermal conductive substrate having a first surface and an opposing second surface; and at least one organic metal multilayer film formed on at least one of the first and second surfaces. The organic metal multilayer film comprises a plurality of metal layers and a plurality of organic layers. Each of the metal layers and each of the organic layers are alternately linked to one by another. Each of the metal layers comprises a plurality of metal particles each in contact with one or more organic molecules of adjacent organic layers.
申请公布号 US2007048520(A1) 申请公布日期 2007.03.01
申请号 US20060440292 申请日期 2006.05.24
申请人 HON HAI PRECISION INDUSTRY CO., LTD. 发明人 HSIAO BOR-YUAN;CHANG CHUN-YI;TUNG TSAI-SHIH
分类号 B32B5/16;B05D1/12;B05D1/18;B05D1/36;B32B15/04 主分类号 B32B5/16
代理机构 代理人
主权项
地址