INSPECTION METHOD AND INSPECTION DEVICE FOR SUBSTRATES

摘要

An inspection method for through- wafer interconnects of a through- wafer interconnects substrate (105) the substrate having a front-side and a back-side on which back-side at least one contact (218) is formed, comprises the steps of placing a multi-contact foil (108) on the back-side and contacting the multi-contact foil (108) with a contacting substrate (109). An inspection device (107) for a through-wafer interconnects substrate (105) comprising a multi-contact foil (108) contactable to a through-wafer interconnects substrate (105) and contacted to a contacting substrate (105).