发明名称 |
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD FOR MANUFACTURING SAME |
摘要 |
<p>A semiconductor integrated circuit device (10) which has a layered structure is composed of a plurality of semiconductor layers (L1, L2, L3) in which an integrated circuit is formed on a substrate. Each of the semiconductor layers (L1, L2, L3) has a semiconductor integrated circuit portion (16) that includes the abovementioned integrated circuit on a substrate (11). Each of the semiconductor layers (L1, L2, L3) also has on a substrate at least one unit of through-wiring (17a) for electrically connecting the integrated circuit included in the semiconductor integrated circuit portion (16) to an integrated circuit of another semiconductor layer, and a surrounding insulation portion (18) for surrounding and insulating the through-wiring from the semiconductor integrated circuit portion. A structure formed by the surrounding insulation portion (18) and the through-wiring portion (17) composed of a plurality of units of through-wiring (17a) reduces the resistance of the through-wiring portion and increases the degree of integration of a circuit.</p> |
申请公布号 |
WO2007024009(A1) |
申请公布日期 |
2007.03.01 |
申请号 |
WO2006JP317032 |
申请日期 |
2006.08.23 |
申请人 |
HONDA MOTOR CO., LTD.;TOSHIMA, HIROYUKI;NAKAMURA, NATSUO |
发明人 |
TOSHIMA, HIROYUKI;NAKAMURA, NATSUO |
分类号 |
H01L25/065 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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