发明名称 |
Method for treating films |
摘要 |
A method for treating a film by providing a structure including a substrate and an array of upstanding projections each of which includes multiple contact points. The structure is pressed against the surface of a polymeric film to cause deformation or rupture of the film. The film may then be pressed to partially reseal the perforations. The structure can be produced by electroplating a mould which includes an array of elements of dimensions corresponding to the projections of the desired structure. |
申请公布号 |
AU2002214842(B2) |
申请公布日期 |
2007.03.01 |
申请号 |
AU20020214842 |
申请日期 |
2001.11.20 |
申请人 |
AMCOR PACKAGING (AUSTRALIA) PTY LTD |
发明人 |
DAVID LEE CAREW;EROL CRAIG HARVEY;RAMON GLENNY WAYCOTT |
分类号 |
B26F1/24;B29C59/02;B29C59/04;B29C67/20 |
主分类号 |
B26F1/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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