| 摘要 |
PROBLEM TO BE SOLVED: To provide an improved method and device for always controlling a temperature of a substrate support within a desired range. SOLUTION: The substrate support assembly and method for controlling a temperature of a substrate in a process chamber with a temperature uniformity of±5°C are provided. The substrate support assembly includes a thermal conductive body made of an aluminum material, a substrate support surface on a surface of the thermal conductive body which is adapted to support a large area glass substrate thereon, one or more heating elements embedded within the thermal conductive body, and one or more cooling channels embedded within the thermal conductive body which are positioned around the one or more heating elements. A process chamber provided with the substrate support assembly is also provided. COPYRIGHT: (C)2007,JPO&INPIT |
