| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To deal with the tendency of formation in a narrow pitch, and the weakening in a recent semiconductor device. <P>SOLUTION: A semiconductor device 120 with a bump includes a bump 106a which projects to the outside of a protective film 101 and is electrically connected with an electrode 110, while the protective film 101 is formed in an electrode formation side 102a. A via hole 103 which leads to the electrode 110 from the surface is formed in the protective film 101, and a via post 106 which is composed of conductive resin and electrically connected to the electrode 110 is formed in the via hole 103. The via post 106 has the bump 106a which projects to the outside of the surface of the protective film 101, and presents flip chip mounting through sealing resin 107 to a circuit board 108 with it, and thus, the purpose is attained. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
