Optical modulator module package

摘要

An optical modulator module package includes a substrate having a through-hole through which light passes and having a circuit formed on at least one of its inner and outer surfaces; a transparent lid held in the through-hole for transmitting incident light inputted to an optical modulator element and diffracted light emitted from the optical modulator element; and a metal connection part attached to a surface of the substrate for mounting the optical modulator element and driver integrated circuits. With an optical modulator module package according to embodiments of the present disclosure, the size of the module package may be minimized, as a transparent lid installed with a displacement from the optical modulator element is embedded within the substrate.