发明名称 |
Hard panel e.g. floor panel, stacking method, involves pasting adhesive strip at upper surface of panel, and stacking panel such that pasted adhesive strip is brought into contact with upper surface of adjacent panel on same pack |
摘要 |
<p>The method involves providing panels (1) with adhesive strips (2-5), and pasting the strip at an upper surface of each of the panels. The panels are stacked in such a manner that the pasted strip is brought into contact with the upper surface of the adjacent panel on the same pack. A fast drying adhesive substance is used for manufacturing the strip and the substance is spread on the panel. An independent claim is also included for a floor panel with a support plate.</p> |
申请公布号 |
DE102005041549(A1) |
申请公布日期 |
2007.03.01 |
申请号 |
DE20051041549 |
申请日期 |
2005.08.31 |
申请人 |
AKZENTA PANEELE + PROFILE GMBH |
发明人 |
EISERMANN, RALF |
分类号 |
B65G57/26;B65D85/48;B65D85/62;B65G1/14 |
主分类号 |
B65G57/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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