MULTILAYERED CIRCUIT BOARD AND ELECTRONIC EQUIPMENT

摘要

A multilayered circuit board which is provided with a low-permittivity interlayer insulating film, and which can significantly improve the performance such as signal transmission characteristics of the multilayered circuit board such as a package and a printed board, because the surface in contact with the interlayer insulating film of the circuit board has no unevenness to eliminate the lowering of production yield and the deterioration of high-frequency signal transmission characteristics; and electronic equipment using the circuit board. The multilayered circuit board (10) comprises, mounted on a substrate, a plurality of wiring layers and a plurality of insulating layers positioned between the plurality of wiring layers, wherein at least part of the plurality of insulating layers are composed of a porous insulating layer (1) containing at least any of materials selected from a porous material group consisting of porous material, aerogel, porous silica, porous polymer, hollow silica and hollow polymer, and a non-porous insulating layer (2) that is the porous insulating layer (1) not containing the porous material group on at least one surface thereof. This multilayered circuit board is used in electronic equipment.