| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for a high frequency module capable of obtaining good transmission characteristic even when the operation frequency is highly increased. SOLUTION: A package for a high frequency module is a high frequency module package in which a pattern layer (5) for the chip connection of a dielectric package having a laminated structure and a package back surface pattern layer (6) are connected with an RF signal line (2) and a GND (1) via a via (3), and has a structure in which a distance between the RF signal line (2) of the pattern layer (5) for chip connection and a GND pattern of an upper layer is increased. COPYRIGHT: (C)2007,JPO&INPIT
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