发明名称 |
MANUFACTURE METHOD OF NONVOLATILE MEMORY DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a split-gate nonvolatile memory device. SOLUTION: A first gate insulating film and a first conductive film are formed on a substrate, and an oxide film pattern is formed by oxidizing the conductive film partially. A floating gate electrode is formed on the first gate insulating film through a process of partly etching the first conductive film by using the oxide film pattern as an etching mask. After a first silicon film is formed on all the surface of the substrate where the floating gate electrode is formed, a tunnel insulating film and a second gate insulating film are formed on the side of the floating gate electrode and a part of the surface of the substrate adjacent to the floating gate electrode respectively by oxidizing the first silicon film. A control gate electrode is formed on the tunnel insulating film and the second gate insulating film. A second silicon film is formed on all the surface of the substrate where the control gate electrode is formed, and the second silicon film is turned to a thermal oxide film. COPYRIGHT: (C)2007,JPO&INPIT
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申请公布号 |
JP2007053362(A) |
申请公布日期 |
2007.03.01 |
申请号 |
JP20060217337 |
申请日期 |
2006.08.09 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
JEONG YOUNG-CHEON;KWON CHUL-SOON;YU JAE-MIN;PARK ZAIGEN;RIM JI-WOON;YOON IN-GU |
分类号 |
H01L21/8247;H01L27/10;H01L27/115;H01L29/788;H01L29/792 |
主分类号 |
H01L21/8247 |
代理机构 |
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