发明名称 |
METHOD AND DEVICE FOR MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for manufacturing a semiconductor device excellent in an embedding property and an electric characteristic with using an insulating film having a small dielectric constant. SOLUTION: The method for manufacturing the semiconductor device comprises the steps of generating a gas plasma 14 by introducing an oxygen gas and a chlorine gas 18 into a chamber 1 with vacuum exhausted, and by supplying an electric power to a plasma antenna 27; then generating a precursor 15 by etching a silicon member 20 to be etched with a chlorine gas radical; adsorbing the precursor 15 to a substrate 3 with an adjustment of a temperature control means 6; then reducing the precursor 15 adsorbed to the substrate with the chlorine gas radical, oxidizing with the oxygen gas radical to produce an SiO<SB>2</SB>film, and embedding the SiO<SB>2</SB>film in the groove having a large aspect ratio. COPYRIGHT: (C)2007,JPO&INPIT
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申请公布号 |
JP2007053276(A) |
申请公布日期 |
2007.03.01 |
申请号 |
JP20050238194 |
申请日期 |
2005.08.19 |
申请人 |
ANGSTROM TECHNOLOGIES:KK;RENESAS TECHNOLOGY CORP |
发明人 |
SAKAMOTO HITOSHI;KOBAYASHI KIYOTERU |
分类号 |
H01L21/316;C23C16/42;H01L21/28;H01L21/31;H01L21/76;H01L21/768;H01L23/522;H01L29/417;H01L29/423;H01L29/49 |
主分类号 |
H01L21/316 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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