发明名称 METHOD AND DEVICE FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method and a device for manufacturing a semiconductor device excellent in an embedding property and an electric characteristic with using an insulating film having a small dielectric constant. SOLUTION: The method for manufacturing the semiconductor device comprises the steps of generating a gas plasma 14 by introducing an oxygen gas and a chlorine gas 18 into a chamber 1 with vacuum exhausted, and by supplying an electric power to a plasma antenna 27; then generating a precursor 15 by etching a silicon member 20 to be etched with a chlorine gas radical; adsorbing the precursor 15 to a substrate 3 with an adjustment of a temperature control means 6; then reducing the precursor 15 adsorbed to the substrate with the chlorine gas radical, oxidizing with the oxygen gas radical to produce an SiO<SB>2</SB>film, and embedding the SiO<SB>2</SB>film in the groove having a large aspect ratio. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007053276(A) 申请公布日期 2007.03.01
申请号 JP20050238194 申请日期 2005.08.19
申请人 ANGSTROM TECHNOLOGIES:KK;RENESAS TECHNOLOGY CORP 发明人 SAKAMOTO HITOSHI;KOBAYASHI KIYOTERU
分类号 H01L21/316;C23C16/42;H01L21/28;H01L21/31;H01L21/76;H01L21/768;H01L23/522;H01L29/417;H01L29/423;H01L29/49 主分类号 H01L21/316
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