| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser device which realizes good adhesion between the electrode of a semiconductor laser element and a die attach for higher reliability and longer operation life. SOLUTION: In a semiconductor laser element 100, a plurality of semiconductor layers 120 are stacked on a substrate 110 to emit laser beam in the direction vertical to the substrate 110. The rear surface electrode 130 of the substrate 110 comprises a gold-rich suppressing layer 140 consisting of gold and at least one kind of materials constituting a die attach material other than gold. The gold-rich suppressing layer 140 is preferred to be stacked with the rear surface electrode 130, and jointed to a die attach 150 of a metallic solder material by way of the gold-rich suppressing layer 140. The rear surface electrode 130 is a multilayer electrode of Au/Sn/Au. The gold-rich suppressing layer 140 is Sn while the die attach 150 is Au-Sn eutectic metal. COPYRIGHT: (C)2007,JPO&INPIT
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