发明名称 |
METHOD OF MANUFACTURING CONDUCTIVE LAYER |
摘要 |
A method of manufacturing a conductive layer is described. A substrate having a dielectric layer thereon is provided. The dielectric layer has a patterned structure and the patterned structure exposes a portion of the conductive layer. The surface of the substrate is cleaned in a first cleaning step and a cap layer is formed over the exposed portion of the conductive layer. Thereafter, the surface of the substrate is cleaned again in a second cleaning step to remove the residual cap layer on the surface of the dielectric layer. Finally, a dry cleaning step is performed to clean and dry the surface of the substrate.
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申请公布号 |
US2007049009(A1) |
申请公布日期 |
2007.03.01 |
申请号 |
US20050162119 |
申请日期 |
2005.08.30 |
申请人 |
HSU CHIA-LIN;FANG LIANG-YUAN;CHEN SHU-JEN |
发明人 |
HSU CHIA-LIN;FANG LIANG-YUAN;CHEN SHU-JEN |
分类号 |
H01L21/4763;H01L21/44 |
主分类号 |
H01L21/4763 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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