Automatic detection of exposed substrates with defocused exposure areas during semiconductor manufacture, involves determining current focus status of exposed substrates based on current and statistical values relative to focus parameter

摘要

The method involves performing an exposure process to one or more substrates (151) provided in the lithography sections (152A,152B) using automated focus adjustment processing based on at least one focus parameter. The current value of the focus parameter is then sent to the error detection module of an error detection system (100). The error detection module determines the current focus status of the exposed substrates based on the current value and statistic value relative to the focus parameter. An independent claim is included for the error detection system.