| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device improving a cooling performance by enhancing an electrical insulating property between the semiconductor device and a heat-dissipating mechanism, and reducing a thermal resistance between the semiconductor device and the heat-dissipating mechanism; and to provide a power conversion apparatus and an on-board electrical-equipment system capable of attaining miniaturization, cost reduction, and improvement in a reliability by using the semiconductor device. <P>SOLUTION: The semiconductor device 3 includes semiconductor chips and lead wirings electrically connected to electrodes for the semiconductor chips. The semiconductor device 3 is housed in a cylindrical heat-dissipating base 2, while the semiconductor device 3 is molded integrally with a high thermal conductive resin having an excellent thermal conductivity and the electrical insulating property. Refrigerant paths 10 are formed in the heat-dissipating base 3, and heat dissipation fins are formed outside the base 3. Alternatively, the heat-dissipating base 3 is housed in a second heat-dissipating base. <P>COPYRIGHT: (C)2007,JPO&INPIT |
