BONDER AND BONDING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a bonder and a bonding method in which highly reliable bonding is performed in a state of bonding quality being stabilized. SOLUTION: In the bonder for bonding an electronic component P sucked to a bonding action portion 13 to a substrate 2 by applying a load and a vibration to the electronic component P, a resilient body 4 is provided on a moving table 1 for bonding the electronic component P and the substrate 2 and, at a preset timing, false bonding preliminary operation is performed for applying a load and a vibration while butting the lower end of the bonding action portion 13 against the resilient body 4 in the state in which the electronic component P is not sucked. COPYRIGHT: (C)2007,JPO&INPIT