| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive paste which can suppress scattering of solder minute pieces with excellent application properties of a paste in narrow and adjacent mounting accompanied with high-density mounting, and which is suitable for the base film formation or the like of an electrode end part in a square chip component. SOLUTION: This conductive paste is composed of 55-65 wt.% of silver powder, 1-5 wt.% of lead-free inorganic binder, 1-10 wt.% of organic vehicle, and 20-40 wt.% of solvent. A weight cumulative particle diameter D<SB>50</SB>by a laser diffraction scattering type particle distribution measuring method of the silver powder is 3-6μm and 50 wt.% or more of the total amount of the silver powder is flaky silver powder of the major axis diameter of 3.0-6.0μm, the minor axis diameter of 2.0-5.0μm, and the thickness of 0.1-0.6μm, and the solvent is a single solvent or its mixture with a boiling point at 240-300°C and vapor pressure of 100-300 hPa at temperature of 200°C. COPYRIGHT: (C)2007,JPO&INPIT
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