| 摘要 |
A method for fabricating a semiconductor component includes the step of providing a semiconductor die having a die contact and at least one integrated circuit in electrical communication with the die contact. The method also includes the steps of forming a first polymer layer on the die, forming a conductor on the polymer layer in electrical communication with the die contact, and forming a wire bonding pad on the conductor. The method also includes the steps of forming a metal layer on the wire bonding pad configured to form the wire bonding pad with a selected thickness, forming a non-oxidizing metal layer on the metal layer, and then wire bonding a wire to the wire bonding pad.
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