| 摘要 |
A packaging assembly ( 100 ) includes a plurality of dissimilar die ( 102, 104, 106 ) bonded to a base board ( 110 ) and ground coupled to a heat sink ( 108 ) through an opening ( 132 ). A mating board ( 112 ) is coupled to the base board ( 110 ) to provide separate surface mountable contacts ( 148 - 158, 166 ) with which to independently bias each die ( 102, 104, 106 ) while the heat sink ( 108 ) provides thermal dissipation for the die. Assembly ( 100 ) provides a surface mountable package well suited to multiband applications. |
