RESIN COMPOSITION FOR BUMP FORMATION, BILAYER LAMINATED FILM FOR BUMP FORMATION, AND METHOD FOR FORMING BUMP

摘要

PROBLEM TO BE SOLVED: To provide a negative radiation sensitive bilayer laminated film for bump formation excellent in the printability of solder paste and pattern profile and easy to peel from a substrate, and a method for producing bumps using the same.

SOLUTION: A composition for a lower layer film of a bilayer laminated film used for bump formation is prepared which comprises (A) an alkali-soluble copolymer having a specific structural unit typified by poly-p-hydroxyphenylacrylamide and (B) an organic solvent. The bilayer laminated film is produced using the composition. Bumps are formed using the laminated film.

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