| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method capable of preventing a bonding metal in assembling from being blown up without causing any disconnection between the surface and rear surface of a substrate in a via hole penetrating the substrate. SOLUTION: There is deposited a photosensitive and conductive organic resin film on the entire surface of a via hole on the surface side of the substrate on which elements are formed, deposited inside the via hole, and deposited on part or the entire surface of the rear surface in the via hole penetrating the substrate. Consequently, it is possible to form stable electric contact between the surface and the rear surface of the semiconductor. COPYRIGHT: (C)2007,JPO&INPIT
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