| 摘要 |
PROBLEM TO BE SOLVED: To improve heat radiation properties when soldering and packaging a chip resistor to a printed circuit board 7, or the like in the chip resistor, where at least one insulating film 3 is formed on the upper surface of an insulating substrate 2 composed in a chip type, a pair of terminal electrodes 4, 5 to the resistant film is provided on the insulating substrate, and the terminal electrode comprises upper surface electrodes 4a, 5a on the upper surface of the insulating substrate, lower surface electrodes 4b, 5b on the lower surface of the insulating substrate, and side electrodes 4c, 5c on the end face of the insulating substrate. SOLUTION: The lower surface electrode 4b in one terminal electrode 4 in the pair of terminal electrodes 4, 5 is extended to a part just under the part in which width dimensions are narrowed by providing a trimming groove 3a, or the like at one portion in the longitudinal direction in the resistant film. COPYRIGHT: (C)2007,JPO&INPIT
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