| 摘要 |
The semiconductor device includes a chip, a sealing resin for sealing the chip, which includes a first lateral side and a second lateral side, both of which are located adjacent to each other, and a plurality of leads that protrude from different positions on the first lateral side. The positions on the first lateral side have different distances from the second lateral side, and the protruding distances of the plurality of the leads are set to be longer as their positions on the first lateral side are located nearer to the second lateral side. The semiconductor device is mounted on a mounting board through a second lateral side of the sealing resin.
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